FR4 Printed Circuit Boards

Full Form : Flame Retardant Epoxy Resin and Glass Fabric Composite
Description :FR4 is a good quality material. It has a high dielectric strength which contributes to its electrical insulation properties. The material has a high strength to weight ratio and is lightweight. It is moisture resistant and has relative temperature resistance as well.
Glass transition temperature/Tg:Typically,130°C
Thermal Conductivity:0.3W
Dielectric Constant:3.9-4.8 across frequencies up to 1 GHz
Avilable Board Thickness :0.35/0.5/0.8/1.0/1.2/1.6/2.0/2.4/3.2mm
Avilable Cu Thickness :18Micron/25Micron/35Micron/70Micron

CEM-1 Printed Circuit Boards

Full Form : Composite Epoxy Material type 1
Description :Glass Cloth Base, Epoxy-Resin, Cellulose Core CEM 1 is a base material for printed circuit boards made of laminated paper.Its a good alternative for FR-4 material when cost is a constraint. CEM 1 has a core of paper, impregnated with epoxy and one outer layer of glass fabric. Due to paper this material is not suitable for d/s or plating process.
Glass transition temperature/Tg:Typically 60-90°C
Dielectric Constant:4.2 up to 1 GHz
Avilable Board Thickness :0.8/1.0/1.2/1.6mm
Avilable Cu Thickness :25Micron/35Micron

FR1 Printed Circuit Boards

Full Form : Flame Retardant Grade 1
Description : FR1 PCB is the most common form of copper PCB,Its a blend of two materials, paper and phenol-formaldehyde resin.Fr1 is a cost-effective Single Layer Printed Circuit Board suitable for tool process and mass production.
Glass transition temperature/Tg:Typically,130°C
Dielectric Constant:4.0-5.0 up to 1 GHz
Avilable Board Thickness0.8/1.0/1.2/1.6mm
Avilable Cu Thickness18Micron/25Micron/35Micron

XPC Printed Circuit Boards

Full Form : Composite Epoxy Material Grade-1
Description :Low cost but with wide range of application, warpage and twist are small and stable, suitable for punching at 40~70℃ Mainly used for toy pcb mobile charger and other cheap and bulk products
Glass transition temperature/Tg:Typically 60-90°C
Dielectric Constant:≤5.5/4.0-5.0≤6.0/4.5-5.5 at 1 GHz
Avilable Board Thickness0.8/1.0/1.2/1.6mm
Avilable Cu Thickness18Micron/25Micron/35Micron

CEM-3 Printed Circuit Boards

Full Form : Composite Epoxy Material type 3
Description :Glass Cloth Base, Epoxy-Resin, Nonwoven Core
Glass transition temperature/Tg:Typically,120°C
Dielectric Constant:3.9-4.8 up to 1 GHz
Avilable Board Thickness0.35/0.5/0.8/1.0/1.2/1.6/2.0/2.4/3.2mm
Avilable Cu Thickness18Micron/25Micron/35Micron/70Micron

Metal Core Printed Circuit Boards

Full Form : Metal Core Printed Circuit Board
Description :MCPCBs are most widely found in LED technologies, as they reduce the number of LEDs required to produce a specific illumination. Light emitting diodes release a great amount of heat in applications such as: Streetlights, Flood light, Ceiling lights and many etc.)
Thermal Conductivity:1W / 2W
Avilable Board Thickness0.8/1.0/1.6mm
Avilable Cu Thickness25Micron/35Micron